年度2020
等級
論文名稱Wang, C. N., Hsueh, M. H., Lai, C. J., Chung, C. C., Chen, W. C., & Wang, S. H. (2020). Improve Chip Side Wall Crack Issue in Nanometer Packing Process of Semiconductor. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(2), 173-180. https://ieeexplore.ieee.org/document/9279332 (SCIE, 2020.12.03)
作者型態