年度2017
等級SCI
論文名稱 Ya-Yu Hsieh, Yun-Chih Tsai, Hong-Ping Lin*, Chun-Han Hsu “Rice husk-derived hierarchical micro/mesoporous carbon-silica nanocomposite as superior filler for green electronic packaging material” Journal of the Chinese Chemical Society 2017, 64, 427-433. (Selected for Cover Figure, SCI, IF=0.862).
作者型態